Rear access DSX system

ABSTRACT

A DSX system for receiving removable jack inserts is disclosed. The system includes a plurality of chassis rearward facing cross-connect arrays and rearward facing IN/OUT arrays. A first circuit board section and a second circuit board section are electrically connected to the arrays. The first circuit board section is positioned behind the removable jack inserts. The second circuit board section is positioned behind the first circuit board section and in front of the cross-connect array and the IN/OUT array.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of application Ser. No. 10/277,173,filed Oct. 18, 2002 now U.S. Pat. No. 6,918,793; which application isincorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates generally to telecommunicationsequipment. More particularly, the present disclosure relates to adigital cross-connect device and system.

BACKGROUND

A digital cross-connect system (DSX) provides a location forinterconnecting two digital transmission paths. The apparatus for a DSXis located in one or more frames, or bays, usually in a telephoneservice provider's central office. The DSX apparatus also provides jackaccess to the transmission paths.

DSX jack inserts are well known and typically include a plurality ofbores sized for receiving plugs. A plurality of switches are providedadjacent the bores for contacting the plugs. The jack inserts areelectrically connected to digital transmission lines, and are alsoelectrically connected to a plurality of termination members used tocross-connect the jack inserts. By inserting plugs within the bores ofthe jack inserts, signals transmitted through the jack inserts can beinterrupted or monitored.

FIG. 1 schematically illustrates a DSX system that is an example of thetype found at a telephone service provider's central office. The DSXsystem is shown including three DSX jack inserts 10 a, 10 b and 10 c.Each DSX jack insert 10 a, 10 b and 10 c is connected to a specificpiece of digital equipment. For example, jack insert 10 a is shownconnected to digital switch 12, jack insert 10 b is shown connected tooffice repeater 14 a, and jack insert 10 c is shown connected to officerepeater 14 b. Each piece of digital equipment has a point at which adigital signal can enter, as well as a point at which the digital signalcan exit. The jack inserts 10 a, 10 b and 10 c each include OUTtermination pins 16 and IN termination pins 18. The DSX jack inserts 10a, 10 b and 10 c are connected to their corresponding pieces of digitalequipment by connecting the OUT termination pins 16 to the signalsexiting the equipment (i.e., going toward the DSX system) and the INtermination pins 18 to the signals entering the equipment (i.e., goingaway from the DSX system).

Referring still to FIG. 1, jack inserts 10 a and 10 b are“cross-connected” to one another by semi-permanent connections. A“semi-permanent” connection is a connection that is more permanent thanthe connections provided by typical patch cords equipped withtip-and-ring plugs. Example semi-permanent connectors include co-axialconnectors, wire wrap connectors, RJ-45 type connectors and insulationdisplacement connectors. The semi-permanent connections extend betweencross-connect fields 19 of the jack inserts 10 a and 10 b. For example,wires 20 connect OUT cross-connect pins of jack insert 10 a to INcross-connect pins of jack insert 10 b. Similarly, wires 21 connect INcross-connect pins of jack insert 10 a to OUT cross-connect pins of jackinsert 10 b. The jack inserts 10 a and 10 b are preferably normallyclosed. Thus, in the absence of a plug inserted within either of thejack inserts 10 a and 10 b, an interconnection is provided through thejack inserts 10 a and 10 b and between digital switch 12 and officerepeater 14 a.

The semi-permanent connection between the digital switch 12 and theoffice repeater 14 a can be interrupted for diagnostic purposes byinserting patch cord plugs within the IN or OUT ports of the jackinserts 10 a and 10 b. Likewise, patch cords can be used to interruptthe semi-permanent connection between the jack inserts 10 a and 10 b toprovide connections with other pieces of digital equipment. For example,the digital switch 12 can be disconnected from the office repeater 14 aand connected to the office repeater 14 b through the use of patch cords23. The patch cords 23 include plugs that are inserted within the IN andOUT ports of the jack 10 a and the IN and OUT ports of the jack insert10 c. By inserting the plugs within the IN and OUT ports of the jackinsert 10 a, the normally closed contacts are opened, thereby breakingthe electrical connection with the office repeater 14 a and initiatingan electrical connection with office repeater 14 b.

An important consideration in a digital cross-connect system is circuitdensity. Another important consideration is cable management. Ingeneral, improvement with regards to these and other considerations isdesired.

SUMMARY

One embodiment of the present invention relates to a DSX systemincluding a cross-connect field and an IN/OUT field that are accessiblefrom the rear of the system.

Another embodiment of the present invention relates to a DSX systemincluding a telecommunications device configured to receive jackinserts, the DSX system providing normal-through circuits that normallyelectrically connect a cross-connect field and an IN/OUT field, thecross-connect field and the IN/OUT field being accessible from the rearof the system.

A variety of aspects of the invention are set forth in part in thedescription that follows, and in part will be apparent from thedescription, or may be learned by practicing various aspects of thedisclosure. The aspects of the disclosure may relate to individualfeatures as well as combinations of features. It is to be understoodthat both the foregoing general description and the following detaileddescription are exemplary and explanatory only, and are not restrictiveof the claimed invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a prior art DSX system;

FIG. 2 is a front perspective view of a DSX system that is an embodimentin accord with the present disclosure, the system includes a pluralityof chassis vertically arranged;

FIG. 3 is an exploded front perspective view of an embodiment of achassis in accord with the present disclosure, the chassis including aplurality of jack insert modules and a back plane;

FIG. 4 is an exploded front perspective view of the plurality of jackinsert modules and a back plane assembly illustrated in FIG. 3;

FIG. 5 is an exploded front perspective view of an embodiment of a jackinsert module in accord with the present disclosure, the jack insertmodule including a plurality of jack inserts;

FIG. 6 is a front elevational view of the jack insert module of FIG. 5;

FIG. 7A is a schematic diagram of the DSX system that is an embodimentin accord with the present disclosure;

FIG. 7B is a schematic diagram of the DSX system of FIG. 7A that isanother embodiment in accord with the present disclosure;

FIG. 8 is an exploded front perspective view of an embodiment of a backplane assembly in accord with the present disclosure and illustrated inFIG. 3;

FIG. 9 is a rear elevational view of the chassis and back plane assemblyshown in FIGS. 3 and 8;

FIG. 10 is an exploded front perspective view of the jack insert moduleused with an alternative embodiment of back plane circuit boardarrangement in accord with the present disclosure;

FIG. 11 is an exploded front perspective view of yet another jack insertmodule embodiment having a back plane circuit board embodiment in accordwith the present disclosure;

FIG. 12 is a side elevational view of the jack insert module of FIG. 11;

FIG. 13 is an exploded front perspective view of another chassisembodiment having an arrangement configured to receive the jack insertmodule embodiment of FIG. 11;

FIG. 14 is a front perspective view of the chassis embodiment of FIG.13; and

FIG. 15 is an enlarged rear perspective view of a portion of the chassisembodiment of FIG. 14.

DETAILED DESCRIPTION

Reference will now be made in detail to exemplary aspects of the presentdisclosure that are illustrated in the accompanying drawings. Whereverpossible, the same reference numbers will be used throughout thedrawings to refer to the same or like parts.

FIGS. 2–15 illustrate embodiments of a chassis 32, 332 having featuresthat are examples of how inventive aspects in accordance with theprinciples of the present disclosure may be practiced. The preferredfeatures are adapted for promoting cable management and enhancing thecircuit density of the chassis 32.

I. Brief Overview of a System Incorporating the Disclosed Chassis

FIG. 2 illustrates a high density DSX system 30 that is one embodimentof a system incorporating an embodiment of a chassis 32 of the presentinvention. The DSX system 30 includes a bay 31 having a front side 52and an opposite back side 54. The bay 31 is configured to hold aplurality (e.g., eighteen) of chassis 32. As shown in FIG. 3, forexample, each chassis 32 is sized to hold a plurality (e.g., twenty-one)of removable jack modules 34. Each of the jack modules 34 includes ajack mount 35 configured to hold a plurality (e.g., four) of jackinserts 36, 38 (FIG. 5). The jack modules 34 are electricallyinterconnected to a back plane 24 (FIG. 3) that mounts at the rear ofeach chassis 32. The back plane 24 includes a rearwardly facingcross-connect field 40 and a rearwardly facing IN/OUT field 42 (FIG. 3).The fields 40, 42 may also be referred to as panels, arrays, or blocks.The fields 40, 42 include a plurality of termination structures thatinterconnect with a cross-connect region 70 and an IN/OUT region 68,located at the back side 54 of the bay 31 (shown schematically in FIG.11B). Regions 68, 70 provide end user interface locations at the rear ofthe bay 31.

In general, the DSX system 30 defines normal-through circuits includingnormal through switches that provide electrical pathways between theIN/OUT field and the cross-connect field. Parts corresponding to thenormal-through circuits provide means for breaking the normal-throughconnections between the IN/OUT and cross-connect fields to allow forsignal patching and test operations. Monitor ports can also be provided.

II. Chassis

Referring now to FIG. 3, the chassis 32 of the DSX system 30 includes achassis housing 100 having a front or front side 52 a and a rear or backside 54 a. A top wall 102 and a bottom wall 104 extend between the frontside 52 a and the back side 54 a of the chassis housing 100. The top andbottom walls 102, 104 are interconnected by sidewalls 106, 108. In theillustrated embodiment, mounting flanges 112 extend from the sidewalls106, 108 adjacent the front side 52 a of the chassis housing 100. Themounting flanges 112 are used to mount the chassis 32 to the bay 31.Preferably, the chassis 32 is mounted to the bay 31 such that the frontside 52 a of the chassis corresponds to the front side 52 of the bay 31,and the back side 54 a of the chassis corresponds to the opposite backside 54 of the bay 31.

The top and bottom walls 102, 104 and sidewalls 106, 108 cooperate todefine an interior 110 for receiving the jack modules 34. The housing100 has a front opening 114 located adjacent the front side 52 a of thehousing 100 and a rear opening 116 located adjacent the back side 54 aof the housing 100. A lower mounting strip 118 extends from the bottomwall 104 adjacent the rear opening 116. The lower mounting strip 118 isused to mount a back plane assembly 39 to the chassis housing 100. Inthe illustrated embodiment the mounting strip 118 extendsperpendicularly from the bottom wall 104 and includes a plurality ofholes 99 for receipt of mounting fasteners 101. An upper mounting strip119 (FIG. 9) extends from the top wall 102 adjacent the rear opening116. The upper mounting strip 119 also includes a plurality of holes(not shown) for receipt of mounting fasteners 103. The fasteners 101,103 extend through the mounting strip holes and into correspondingthreaded holes (not shown) of the back plan assembly 39 to securelyfasten the back plane assembly to the chassis housing 100.

Referring generally to FIGS. 2, 3 and 9, the rear opening 116 isconfigured to provide rear access to the cross-connect field 40 and theIN/OUT field 42 of the back plane 24. Thus, when the chassis 32 ismounted to the bay 31, electrical connections (not shown) may be routedfrom the back side 54 of the bay 31 to the back side 54 a of the chassis32 (i.e. to termination structures or members 44 of the cross-connectfield 40 and the IN/OUT field 42 of the back plane 24), or vise versa.

Still referring generally to FIGS. 2 and 3, providing rear accesseliminates space constraints associated with front access arrangements,and accommodates a greater number of jack inserts. In one embodiment,the chassis 32 is adapted for housing a plurality of jack inserts,preferably at least 56 jack inserts, or 14 jack modules each having 4jack inserts. To conform to conventional international standards, thechassis 32 can have a length L1 of about 19 inches. An embodiment havinga length L1 of about 19 inches can house, for example, 64 jack inserts,or 16 jack modules. This embodiment has a jack insert density of greaterthan 40 jack inserts per foot of chassis length. Alternatively, inaccordance with standard United States specifications, the chassis 32could be configured to have a length L1 of about 23 inches, as shown inFIG. 3. An embodiment having a length L1 of about 23 inches can house,for example, 84 jack inserts, or 21 jack modules. This alternativeembodiment has a jack insert density of greater than 43 jack inserts perfoot of chassis length.

The chassis of the present disclosure is also configured to providegreater bay circuit density. In particular, the chassis has a height H1and a depth D1. The height H1 is preferably less than 4 inches, morepreferably less than or equal to 3.5 inches. One aspect for reducing theheight as compared to prior art chassis relates to the positioning ofboth the IN/OUT filed and the cross-connect field at the rear of thechassis directly behind the jack modules. The rear access arrangement ofthe present disclosure reduces the overall height of the chassis andincreases the stacked chassis density within the bay 31.Correspondingly, the bay circuit density increases.

In the illustrated embodiment, the depth D1 of the chassis is between 4inches and 6 inches. Preferably the chassis depth D1 is equal to or lessthan 5 inches. Of course, other sizes of chassis and other numbers ofjack modules could also be used.

III. DSX Jack Module

Referring now to FIG. 5, the jack modules 34 of the DSX system 30generally includes the jack mount 35 for holding a plurality of jackinserts 36, 38, and a first circuit board section or module circuitboard 130 for providing electrical connections between the jack inserts36, 38 and the cross-connect and IN/OUT fields 40, 42 of the back plane24 (FIG. 3). The jack mount 35 has a front 25 and a rear 29. The jackinserts 36, 38 are inserted into the jack mount 35 from the front 25.The module circuit board 130 is positioned adjacent the rear 29 of thejack mount 35.

a. Jack Mount

The jack mount 35 of each jack module 34 is preferably configured toremovably receive the jack inserts 36 and 38. For example, the jackinserts 36, 38 can be retained within the jack mount 35 by resilientlatches 27 as described in U.S. Pat. No. 6,116,961, which is herebyincorporated by reference. By flexing the latches 27, the jack inserts36, 38 can be manually inserted into or removed from the jack mount 35.

Still referring to FIG. 5, the jack mount 35 of each jack module 34includes a plurality of sockets 136 and contact pins 138 (as describedin U.S. Pat. No. 6,116,961) for providing electrical interfaces with thejack inserts 36, 38 when the jack inserts 36, 38 are inserted in thejack mount 35. When assembled, the contact pins 138 are electricallyconnected directly to the module circuit board 130. Correspondingly, thecontact pins 138, or intermediate electrical conductors, interconnectthe jack inserts 36, 38 to the module circuit board 130.

While the jack module 34 is shown as a “four-pack” (i.e., a moduleincluding four jack inserts), it will be appreciated that alternativemodules can include jack mounts sized to receive more or fewer than fourjack inserts. However, it is contemplated that in other embodiments thejack inserts can be mounted directly within a chassis without usingseparate jack mounts for holding the jack inserts. Further otherembodiment may include different jack insert mounting configurations.For example, in one embodiment, jack inserts can be fastened within thechassis by fasteners (e.g. bolts or screws) as compared to resilientlatches.

b. DSX Jack Inserts

In the preferred embodiment, the jack inserts include odd jack inserts36 and even jack inserts 38. What is meant by “odd” and “even” is thatthe odd jack inserts 36 have access ports that are vertically offsetfrom respective access ports of the even jack inserts 38. Thisconfiguration is designed such that when the odd and even jack inserts36, 38 are mounted within the jack mount 35, plug bores defined by theodd and even jack inserts 36, 38 are vertically staggered relative toone another, as will be described in greater detail.

Still referring to FIG. 5, each of the jack inserts 36, 38 includes ajack body 33. Preferably the jack body 33 is made of a dielectricmaterial (e.g. plastic). The jack body 33 includes a front face 140defining a plurality of access ports, in particular, an out port 148, amonitor out port 149, an in port 150 and a monitor-in port 151. (Theports are referred to generally as 148–151. In the Figures, thesubscript ‘a’ (e.g. 148 a) refers to the port of the odd jack inserts 36and the subscript ‘b’ refers to the ports of the even jack inserts 38.)The access ports 148–151 are sized to receive tip-and-ring plugs. It isto be understood that the term “port” and “bore” are interchangeable.The jack inserts 36, 38 also define a light emitting diode (LED) accessport 152 for receiving a tracer lamp 157. The access ports 148–152 areaccessible from the front 52 a of the chassis 32 when operablypositioned within the chassis (FIG. 2).

The jack inserts 36, 38 include electrical contacts 133 corresponding toeach of the ports 148–151. The contacts 133 include tails 134 thatproject rearwardly from each of the jack inserts 36, 38. When the jackinserts 36, 38 are inserted within the jack mount 35, the tails 134 ofthe contacts 133 slide within the sockets 136 of the jack mount 34 toprovide electrical connections between the module circuit board 130 andthe jack inserts 36, 38. When the jack inserts 36, 38 are removed fromthe jack mount 35, the jack inserts 36, 38 are electrically disconnectedfrom the module circuit board 130 of the jack module 34.

As best shown in FIG. 6, the front face 140 of the jack inserts 36, 38is generally planar and defines, the out port 148, the monitor-out port149, the in port 150, the monitor-in port 151, and the LED port 152.With reference to the odd jack inserts 36, the monitor-out port 149 a isspaced a first spacing S_(1a) from the out port 148 a. The out port 148a is spaced a second spacing S_(2a) from the in port 150 a. The in port150 a is space a third spacing S_(3a) from the monitor in port 151 a. Inthe preferred embodiment, the third spacing S_(3a) is greater than thefirst spacing S_(1a); more preferably, the third spacing S_(3a) isgreater than both the first spacing S_(1a) and the second spacingS_(2a); most preferably, the third spacing S_(3a) is greater than firstspacing S_(1a) and the first spacing S_(1a) is greater than the secondspacing S_(2a).

With reference to the even jack inserts 38, it will be appreciated thatthe ports 148 b–152 b are arranged in a different pattern than the ports148 a–152 a. For example, a larger spacing exists between themonitor-out port 149 b and the out port 148 b of even jack inserts 36 ascompared to the monitor out port 149 a and the out port 148 a of the oddjack inserts 38. Additionally, a reduced spacing exists between the inport 150 b and the monitor-in port 151 b as compared to the in port 150a and the monitor in port 151 a. More specifically, the monitor-out port149 b is spaced a first spacing S_(1b) from the out port 148 b. The outport 148 b is spaced a second spacing S_(2b) from the in port 150 b. Thein port 150 b is spaced a third spacing S_(3b) from the monitor-in port151 b. In the preferred embodiment, the first spacing S_(1b) is greaterthan the third spacing S_(3b); more preferably, the first spacing S_(1b)is greater than both the third spacing S_(3b) and the second spacingS_(2b); most preferably, the first spacing S_(1b) is greater than thirdspacing S_(3b) and the third spacing S_(3b) is greater than the secondspacing S_(2b).

As illustrated in FIG. 6, the out port 148 a and the in port 150 a ofthe odd jack inserts 36 are positioned or aligned with the firstspacings S_(1b) of the even jack inserts 38. Likewise, the out port 148b and the in port 150 b of the even jack inserts 38 are positioned oraligned with the third spacings S_(3a) of the odd jack inserts 36. Thisstaggering configuration, in combination with the rear access, is oneaspect of the disclosed system contributing to the high circuit densityfeature of the present invention.

Referring now to FIG. 7A, a circuit schematic of one of the jack inserts36, 38 in relation to the rear access configuration of the chassis 32 isillustrated. As shown, the electrical contacts of the jack inserts 36,38 include a voltage contact −48V, tracer lamp contact TL, and returncontact RET corresponding to an LED circuit. The electrical contactsalso include tip springs T and ring springs R corresponding to themonitor-in and monitor-out ports. The electrical contacts furtherinclude a tip-in contact TI, ring-in contact RI, cross-connect tip-incontact XTI, and cross-connect ring-in contact XRI corresponding to thein port. The electrical contacts further include a tip-out contact TO,ring-out contact RO, cross-connect tip-out contact XTO, andcross-connect ring-out contact XRO corresponding to the out port. Thecontacts operate in the same manner described in U.S. Pat. No. 6,116,961that was previously incorporated by reference. The contacts TI, RI, XTIand XRI and the contacts TO, RO, XTO and XRO include “normal” springsthat cooperate to define normally “through” or normally “closed”switches that provide electrical pathways between the cross-connectfield 40 and the IN/OUT field 42 in the absence of a plug.

In particular, first and second circuit board sections 130, 120 (seeFIG. 4) include tracings 190 that electrically connect terminationstructures 44 of the IN/OUT field 42 to the contacts TI, RI, TO and ROof the jack inserts 36, 38. The circuit board sections 130, 120 alsoinclude tracings 192 that provide electrical connections betweentermination structures 44 of the cross-connect field 40 and contactsXTI, RTI, XTO and XRO of the jack inserts 36, 38. Additionally, thecircuit board sections 130, 120 include tracings 194 that electricallyconnect the tracings 190 to the MONITOR ports of the jack inserts 36,38.

Further, as illustrated schematically, the circuit board sections 130,120 include tracing 196 for connecting a sleeve ground pin (not shown)to the sleeve ground contact SG of the jack inserts 36, 38; tracing 198for connecting a tracer lamp pin of the cross-connect field 40 to thetracer lamp contacts TL of the jack inserts 36, 38; tracing 200 forconnecting a power pin (not shown) to the voltage contact −48V of thejack inserts 36, 38; and tracing 202 for connecting a power return pin(not shown) to the return contact RET of the jack inserts 36, 38.

FIG. 7B illustrates the one jack inserts 36, 38 interconnected to theDSX system 30. The chassis 32 is arranged such that the back plane 24faces the back side 54 of the bay 31. Thus, when the chassis 32 ismounted to the bay 31, intermediate electrical connections 65 and 75 canbe routed from the back plane 24 of the chassis 32 to an IN/OUT region68 and a cross-connect region 70 located on the back side 54 of the bay31 (see also FIG. 2).

c. Jack Module Circuit Board

Referring back to FIG. 5, the module circuit board 130 of the jackmodule 34 is positioned directly behind the jack mount 35 and jackinserts 36, 38. The module circuit board 130 includes a major first side131, a major second side 135, and a plurality of plated through-holes139. When the jack module 34 is inserted within the chassis housing 100,the major first side 131 faces the front opening 114 of the chassis 32(FIGS. 3 and 5) and the major second side 135 faces the rear opening 116of the chassis.

The plurality of plated through-holes 139 receive the contact pins 138of the sockets 136 to provide a direct electrical connection between themodule circuit board 130 and the pins 138. When a jack insert 36, 38 isinserted within the jack mount 35, the contacts 133 of the jack inserts36, 38 are in electrical contact with the sockets 136 and thereby alsowith the module circuit board 130.

The module circuit board 130 also includes a plurality of connectorbores 142. In the illustrated embodiment, the plurality of connectorbores 142 are located beneath the plated through holes 139. In analternative arrangement, the connector bores may be located above theplated through holes 139. The connector bores 142 are electricallyconnected to the plated through holes 139 by tracings (not shown) in themodule circuit board 130.

A connector 37 is operably positioned at the connector bores 142 of themodule circuit board 130. What is meant by operably positioned is thatthe connector 37 is electrically interconnected with the connector bores142 and the tracings of the module circuit board 130 to provideelectrical communication between the module circuit board 130 and theconnector 37. As the connector 37 is electrically connected to themodule circuit board 130, the connector 37 is also electricallyconnected to the contact pins 138, and ultimately the contacts 133 ofthe jack inserts 36, 38.

In the embodiment illustrated in FIG. 5, the connector 37 is a maleconnector 144. In the alternative, the connector 37 can be a femaleconnector (FIG. 10). It is to be understood that male and femaleconnectors may be interchanged to operably (i.e. electrically andmechanically) correspond to a mating connector 47 of the back planeassembly 39 (FIG. 4). In the embodiment illustrated in FIG. 4, the maleconnector 144 of the jack module 34 couples with a female connector 122of the back plane assembly 39. The connectors 144 and 122 and theircorresponding circuit boards 130, 120 provide electrical communicationbetween the jack module 34 and the cross-connect field 40 and the IN/OUTfield 42 of the back plane assembly 39.

IV. Back Plane

Referring again to FIG. 3, the back plane 24 includes a back planeassembly 39 that mounts within the interior 110 of the chassis housing100 adjacent the rear opening 116. In general, the jack insert modules34 are interconnected to the back plane assembly 39 by inserting thejack insert modules 34 through the front opening 114 of the chassishousing 100. When fully inserted within the chassis 32, the modules 34and their corresponding jack inserts are electrically connected tocorresponding termination structures 44 of the cross-connect field 40and the IN/OUT field 42.

As best shown in FIG. 8, the back plane assembly 39 includes the secondcircuit board section or back plane circuit board 120 and a plurality ofconnectors 47. In the illustrated embodiment, the back plane circuitboard 120 is a single circuit board and is co-extensive with the backplane 24. The back plane circuit board 120 includes a major first side121 and a major second side 123. The major first side 121 faces thefront opening 114 of the chassis 32 (FIGS. 3, 4 and 8) and the majorsecond side 123 faces the rear opening 116 of the chassis. In theassembled embodiment shown in FIG. 3, the major sides 121, 123 of theback plane circuit board 120 are generally parallel to the major sides131, 135 of the module circuit board 130. Further, the back planecircuit board 120 and the module circuit board 130 are generallyparallel to the back plane 24 of the chassis 32.

The connectors 47 are located on the major first side 121 of the backplane circuit board 120 and electrically connect each individual jackmodule 34 to the back plane circuit board. The back plane circuit board120 is in turn, electrically interconnected with the cross-connect field40 and the IN/OUT field 42.

Referring now to FIG. 9, the back plane assembly 39 includes a powersource 160 that provides power to the back plane circuit board 120 andthereby to each of the individual jack modules 34. The power source 160includes a ground connection, a power connection, and a sleeve groundconnection. In the illustrated embodiment of FIG. 9, the power source160 is located above the cross-connection field 40.

Referring back to FIG. 8, the back plane circuit board 120 includes afirst array of through-holes or openings 143 and a second array ofthrough-holes or openings 145. Preferably the openings 143 and 145 areplated openings configured for receipt of the termination structures 44to provide a direct electrical connection between the back plane circuitboard 120 and the pins 44. In other words, the termination structures 44are directly connected to the back plane circuit board 120 throughelectrical connection with the openings 143 and 145.

In the illustrated embodiment, the termination structures 44 includewire wrap pins/posts. The termination structures may also include orother types of connectors/contacts for terminating a wire (e.g.,insulation displacement connectors; multi-pin connectors; co-axialconnectors such as BNC connectors, 1.6/5.6 connectors or SMB connectors;or RJ series connectors such as RJ45 connectors, RJ48 connectors or RJ21connectors).

The back plane circuit board 120 also includes a plurality of connectorbores 162. In the illustrated embodiment, the plurality of connectorbores 162 are located beneath the openings 143 and 145. In analternative arrangement, the connector bores may be located above theopenings 143 and 145. The connector bores 162 are electrically connectedto the openings 143 and 145 by tracings (not shown) in the back planecircuit board 120.

Referring now to FIGS. 3, 4, and 8, a spacer piece or standoff structure166 is positioned between the back plane circuit board 120 and themodule circuit boards 130 to structurally support and properly align thejack modules 34. In the illustrated embodiment, the standoff structure166 has recesses 176 (FIG. 4) and includes three sections of standoffstructure 166 configured to properly position and orient a plurality ofjack modules 34 (e.g. seven jack modules). It is contemplated thestandoff structure may also include a structure sized to position andorient any other number of jack modules, including a continuous singlestructure sized to position and orient twenty-one jack modules.

As shown in FIG. 4, the standoff structure 166 is secured to the backplane assembly 39 by placing a fastener 169 through a series of holesand threading the fastener 169 into a threaded hole 212 of a supportstructure 147. In particular, the fastener 169 is placed through holes204 and 206 of the jack module 34 (FIG. 5), hole 208 of the standoffstructure 166 (FIG. 4), and hole 210 of the back plane circuit board 120(FIG. 8) to thread into threaded hole 212 of the support structure 147.

As shown best in FIG. 3, the jack module 34 is structurally supported bythe coupled connectors 37 and 47 and the standoff structure 166. Thestandoff structure 166 assists in maintaining a uniform space or gap Gbetween the back plane circuit board 120 and the module circuit board130 to maintain proper orientation, and thereby maintain electricalconnections between the jack module 34 and the back plane assembly 39.

Referring now to FIGS. 8 and 9, the back plane assembly also includes atermination member support structure 147 preferably made of a dielectricmaterial such as plastic. The support structure 147 has a forward side178 and a rearward side 180. The support structure 147 defines a firstfield or array of openings 153 (FIG. 9) for receiving the terminationstructures 44 of the cross-connect field 40, and a second field or arrayof openings 155 for receiving the termination structures 44 of theIN/OUT field 42. The termination structures 44 are preferably press fitor staked through the openings 153, 155 and preferably have ends 154(FIG. 8) that project rearwardly from a rearward side 180 of the supportstructure. Opposite ends 156 of the pins 42 preferably terminate at theopenings 143, 145 of the back plane circuit board 120 to provide anelectrical connection therewith.

In the illustrated embodiment of FIG. 8, the termination structures 44are press fit through molded projections 158 located on the forward side178 of the support structure 147. In an alternative embodiment, thetermination structures can be secured to the support structure bystaking sheets (not shown). It is contemplated that the supportstructure 147 can be either a single one-piece construction thatcorresponds to the entire length of the chassis 32, or can be made up ofindividual and separate constructions corresponding to an individualjack module 34. In the embodiment shown, the support structure 147 isdivided into three support structure sections 147 a, 147 b, and 147 c,each corresponding to seven jack modules. In other embodiments, separateback plane circuit board corresponding to each of the sections 147 a,147 b and 147 c can be used rather than a single board 170. In stillother embodiments, separate back plane boards corresponding to each jackmodule can be used.

V. Assembly

Referring back to FIG. 5, the jack module 34 is assembled by pressfitting the contact pins 138 into the sockets 136 of the jack mount 35.A support member 132 is connected to a bottom edge of the jack mount 35(e.g., by a snap-fit connection). In other embodiments, the jack mount35 and the support member 132 can be formed as a single integral piece.Once the support member 132 and the jack mount 35 have been connected,the resultant piece is mechanically and electrically connected to themodule circuit board 130 by inserting rear ends of pins 138 within theircorresponding plated through holes 139 defined by the module circuitboard 130. The rear ends of the pins 138 can be soldered in the firstcircuit board section 130 to further secure the connections. Theconnector 37 is also connected to the corresponding plated-through holes142 defined by the module circuit board 130.

The support member 132 includes a mounting hole 214. A fastener 170(FIG. 4) is inserted through a hole 214 in the support member 132 and ahole 216 in the module circuit board 130 (FIG. 5) to secure the assemblytogether. The fastener 170 also functions to secure the jack modules 34within the chassis 32 by insertion through a hole 218 in the back planecircuit board 120 (FIG. 8) and engagement with a threaded hole 220 insupport structure 147.

To mount a jack module 34 within the chassis 32, the jack module 34 isinserted through the front opening 114 of the chassis 32. The jackmodule 34 is inserted rearwardly into the interior 110 of the chassis 32until the connector 37 of the jack module engages the correspondingconnector 47 that projects forwardly from the back plane assembly 39 ofthe chassis 32. The fasteners 169, 170 are then inserted through thejack mounts 34, and through corresponding holes, to secure the jackmodules 34 to the chassis 32. It is to be understood that in accord withthe principles disclosed, the system can be configured such that thejack inserts are inserted within the chassis and directly connected tothe back plane without the intermediate jack module 34 connection.

In the illustrated assembly shown in FIGS. 3 and 4, the jack modules 34are positioned in a side-by-side relationship, thus the module circuitboards 130 of the jack modules are aligned along a common plane. In theillustrated embodiment, the common plane of the module circuit boards isgenerally parallel to the back plane 24 of the chassis.

To remove the jack mounts 34 from the chassis 32, the fasteners 169, 170are removed and the jack mounts 34 can be manually pulled from the frontopening 114 of the chassis 32.

VI. Alternative Embodiments

FIG. 10 shows an alternative DSX device including a back plane assembly39′ having a plurality of individually sized back plane circuit boards120′ that are configured and sized to correspond to a single jack module34. In this embodiment, each of the individual back plane circuit boards120′ can be electrically interconnected to a power source by a daisychain strip, similar to the power strip 552 shown in FIG. 13. In theembodiment shown in FIG. 10, the connector 37 of the module circuitboard 130 is a female 122 connector and the mating connector 47 of theback plane circuit board 120′ is a male connector 144. In thisembodiment an alternative spacer piece 166′ is provided. The alternativespacer piece 166′ is correspondingly sized to the individual back planecircuit board 120′.

FIGS. 11–15 illustrate another embodiment of a chassis 332 and a jackmodule assembly 334. As illustrated in FIGS. 13–15, the chassis 332includes a chassis housing 400 having a front or front side 352 a and arear or back side 354 a. A top wall 402 extends between the front side352 a and the back side 354 a of the chassis housing 400. The chassishousing 400 includes sidewalls 406, 408 having mounting flanges 412 thatextend from the sidewalls 406, 408 adjacent the front side 352 a of thechassis housing 400 to mount the chassis 332 to the bay 31.

The bottom of the chassis housing 400 can be open as shown. The top wall402 and sidewalls 406, 408 cooperate to define an interior 410 forreceiving the jack modules 334. The interior 410 has a front opening 414located adjacent the front side 352 a of the housing 400 and a rearopening 416 located adjacent the back side 354 a of the housing 400. Amounting strip 418 extends between the side walls 406, 408 along thebottom of the interior 410 adjacent the rear opening 416. The mountingstrip 418 is used to mount the second embodiment of the jack module 334to the chassis housing 400.

Referring now to FIGS. 11 and 12, the jack modules assembly 334 includesa jack mount 335 for holding a plurality of jack inserts, preferably oddjack inserts 36 and even jack inserts 38. The jack mount 335 has aconstruction similar to the jack mount (34) shown in the previousembodiment. However, the jack module assembly 334 includes a flexiblecircuit board 500 for providing electrical connections between the jackinserts 36, 38 and the termination structures (not shown) of thecross-connect field 340 and the IN/OUT field 342 of the jack moduleassembly 334. Similar fields 340, 342 are provided in the embodiment ofFIG. 10. The flexible circuit board 500 includes the functionality ofboth the first or module circuit board section (130) and the second orback plane circuit board section (120) of the previous embodiment.

a. Jack Mount

The jack mount 335 of each jack module assembly 334 is preferablyconfigured to removably receive the odd and even jack inserts 36 and 38and includes a plurality of sockets 436. The sockets 436 provideelectrical interfaces with the jack inserts 36, 38 when the jack inserts36, 38 are mounted in the jack mount 335. The sockets 436 includecontact pins (not shown) that electrically connect directly to theflexible circuit board 500.

As shown in FIG. 11, the flexible circuit board 500 is positioneddirectly behind the jack mount 335. The flexible circuit board 500includes the first portion 502, a second portion 506, and a bend orintermediate portion 504.

The first portion 502 includes a plurality of plated through-holes 439that receive the contact pins (not shown) of the sockets 436 to providea direct electrical connection between the flexible circuit board 500and the pins. The flexible circuit board 500 also includes tracingslocated along the intermediate portion (not shown) that electricallyinterconnect the plated through holes 439 to tracings (not shown) in thesecond portion 506 of the flexible circuit board 500.

Similar to the back plane circuit board (120) of the previousembodiment, the second portion 506 of the flexible circuit board 500includes a first array of through-holes or openings 443 and a secondarray of through-holes or openings 445. Preferably the openings 443 and445 are plated openings configured for receipt of the terminationstructures (such as wire wrap pins (44) shown in the previousembodiment) to provide a direct electrical connection between thetracings of the second flexible circuit board portion 506 and thetermination structures. Similar to the previous embodiment, the jackinserts 36, 38 are accordingly in electrical communication with thecross-connect field 340 and the IN/OUT field 342 of the jack moduleassembly 334.

In the illustrated embodiment, the flexible circuit board 500 has alength L3 sized to correspond a single jack module assembly 334. Theflexible circuit board 500 has an extended height that is greater thanapproximately twice the height of the jack inserts 36, 38. The extendedheight is equivalent to the sum of a first dimension d1 of the firstportion 502 of the flexible circuit board 500, a second dimension d2 ofthe intermediate second portion 504, and a third dimension d3 of thesecond portion 506.

The first and second portions 502, 506 of the flexible circuit boardalso have major first sides 581 and 585, and major second sides 583 and587, respectively. The major first sides 581, 583 of the first andsecond portions 502, 506 face the front opening 114 of the chassis 32(FIGS. 11 and 13) and the major second sides 583, 587 face the rearopening 116 of the chassis.

Still referring to FIGS. 11 and 12, the jack module assembly 334 alsoincludes a one-piece support structure 447, preferably made of adielectric material such as plastic. The support structure 447 has aforward side 478 and a rearward side 480. As shown best in FIG. 15, thesupport structure 447 defines a first field or array of openings 453 forreceiving termination structures (not shown) of the cross-connect field340. The support structure 447 also defines a second field or array ofopenings 455 for receiving termination structures of the IN/OUT field342. The termination structures are preferably press fit or stakedthrough the openings 453, 455 and preferably have ends that projectrearwardly from the rearward side 480 of the support structure 447.Opposite ends of the termination structures preferably terminate at thesecond portion 506 of the flexible plane circuit board 500 to provide anelectrical connection therewith. Referring back to FIGS. 7A and 7B, theflexible circuit board electrically operates in substantially the sameway as schematically represented and described with respect to theprevious embodiment.

Referring again to FIG. 11, the jack module assembly 334 also includes aclip or support member 432. The support member 432 is configured todetachably connect with the jack mount 335. The support member 432 ofthe second embodiment includes an extended portion 516 configured tomate with a connection region 518 of the support structure 447. Theextended portion 516 includes stop surfaces 520 that interface with theconnection region 518 of the support structure to position the supportstructure 447 a distance from the jack mount 335.

A spacer piece or standoff structure 508 is disposed between the jackmount 335 and the support structure 447 and also assists to position thesupport structure 447 a distance from the jack mount 335. The spacerpiece 508 includes through holes 510 through which fasteners (not shown)extend to engage corresponding threaded holes 522 formed in the supportstructure 447 to secure the spacer piece 508 to the support structure447. The spacer piece 508 also includes a recess 524 having a throughhole 512. In assembly, a fastener (not shown) is inserted through a hole526 in the jack mount 335, through the spacer hole 512, and engaged witha threaded hole 528 in support structure 447 to secure the jack moduleassembly 334 together.

As best shown in FIG. 12, the spacer piece 508 and the support member432 are configured such that the distances provided between the supportstructure 447 and the jack mount 335 define a uniform space or gap G.The first portion 502, the second portion 506, and the intermediateportion 504 of the flexible circuit board 500 are arranged within thegap G.

Still referring to FIGS. 11 and 12, the support structure 447 of theillustrated embodiment includes a stepped region 514. The stepped region514 offsets the cross-connect field 340 from the IN/OUT field 342. Inparticular, the stepped region 514 projects the cross-connect field 340rearwardly beyond the IN/OUT field 342. The offset or stepped region 514can be used in systems where the support structure 447 serves as acustomer interface region. This stepped region assists indifferentiating the cross-connect field 340 with the IN/OUT field 342and in improving access and cable management.

In the alternative, the stepped region can be arranged to project theIN/OUT field rearwardly beyond the cross-connect field. As shown in FIG.10, the stepped support structure 447 may also be used with theembodiment having individual back plane circuit board 120′. It iscontemplated that the stepped support structure 447 can also be usedwith a unitary back plane circuit board (i.e. back plane circuit board120 shown in FIG. 8.)

Referring back to FIGS. 13–15, a tray assembly 530 may be providedadjacent the cross-connect field 340 and the IN/OUT field 342. The trayassembly 530 includes a shelf portion 532 and a hinged door 534pivotally connected to the shelf portion 532. The shelf portion 532connects to the chassis housing 400 at connections, i.e. brackets 536,located on the side walls 406, 408. In the depicted embodiment, theshelf portion 532 is below the cross-connect fields 340 and separatesthe cross-connect fields 340 from the IN/OUT field 342.

The hinged door 534 of the tray assembly 530 is held in an upright orclosed position by retaining structures 538. The retaining structure 538in the illustrated embodiment includes arms 540 that extend outwardlyfrom the top wall 402 of the chassis 400 and hooked ends 544 thatinterconnect with latches 542 located on the hinged door 534.

Still referring to FIGS. 13–15, a power source 550 is located adjacentthe rear opening 416 to power each of the individual jack moduleassemblies 334. The power source 550 in the illustrated embodimentincludes a power strip 552 having a primary power input 554 and aplurality of power connectors 556 electrically connected in adaisy-chain configuration.

The power strip 552 mounts to the tray assembly 530 along a mountingpiece 558 that extends along an edge 560 of the shelf portion 532. Themounting piece 558 includes a plurality of slots 562 corresponding tothe power connectors 556 of the power strip 552. Some non-slottedportions 564 of the mounting piece 558 include fastener connections 566corresponding to fastener holes 568 of the power strip 552 to secure thepower strip 552 to the tray assembly 530.

As can be seen best in FIG. 15, the tray assembly 530 defines a channel570 within which wires from the cross-connect field 340 can be routedand managed. As can be appreciated, when a plurality of chassis 332 arearranged in the bay 31, the channel 570 of the tray assemblies 530separate each of the cross-connect fields 340 and the IN/OUT fields 342to provide an organized cable/wire-management system.

It will be appreciated that the embodiments of FIGS. 10–15 can be usedas stand-alone units with the rear sides of the devices providing directend user interface locations. By “stand-alone” it is meant that separateuser interface locations (e.g., regions 68, 70) in addition to thechassis devices themselves need not be used.

VII. Use of DSX System

It will be appreciated that the DSX system 30 of the present disclosureis utilized in the same manner as a conventional DSX system. The IN/OUTfields 42, 342 allow the jack inserts 36, 38 to be connected to piecesof digital equipment. The cross-connect fields 40, 340 allow the jackinserts 36, 38 to be cross-connected by jumpers. The jack inserts 36, 38provide normally-through connections between the digital equipmentconnected to the IN/OUT blocks 42, 342 and the cross-connect blocks 40,340. By inserting patch plugs in the monitor ports of the jack inserts36, 38, signals passing through the jack inserts 36, 38 can be monitoredwithout interrupting the signals. The tracer lamp circuits allow thecross-connected jack inserts being monitored to be traced as isdescribed in U.S. Pat. No. 6,116,961. Plugs can be inserted in the in orout ports of the jack inserts 36, 38 for testing or diagnostic purposes,or for re-routing signals to different pieces of digital equipment.

DSX systems are also disclosed in U.S. application Ser. No. 10/277,174,entitled HIGH DENSITY DSX SYSTEM, and U.S. application Ser. No.10/177,175, entitled TERMINATION PANEL WITH FANNING STRIPS; bothapplications incorporated herein by reference. Since many embodiments ofthe invention can be made without departing from the spirit and scope ofthe invention, the invention resides in the claims hereinafter appended.

1. A telecommunications jack module comprising: a jack mount formounting within a chassis, the jack mount having a front and a rear; aplurality of jack inserts adapted to be inserted into the jack mountthrough the front of the jack mount, the jack inserts including accessports adapted for receiving plugs, the jack inserts includingnormal-through switches having tip and ring springs for contacting theplugs when the plugs are inserted within the access ports, the normalthrough switches also including normal springs that engage the tip andring springs when the plugs are not inserted in the access ports, theaccess ports being accessible from the front of the jack mount;cross-connect termination structures accessible from the rear of thejack mount; IN/OUT termination structures accessible from the rear ofthe jack mount; first and second circuit board sections electricallyconnected together, the first circuit board section being located behindthe jack mount and in front of the second circuit board section, thesecond circuit board section being located in front of the cross-connecttermination structures and the IN/OUT termination structures, the firstand second circuit board sections each including a major first side anda major second side, the major first sides facing in a forward directionand the major second sides facing in a rearward direction; andnormal-through circuits that electrically connect the IN/OUT terminationstructures to the cross-connect termination structures, thenormal-through circuits including the normal-through switches, thenormal-through circuits also including electrical pathways provided bythe first and second circuit board sections.
 2. The jack module of claim1, wherein the first and second circuit board sections are separated bya stand-off piece.
 3. The jack module of claim 1, wherein the first andsecond circuit board sections include separate circuit boardselectrically interconnected by an electrical connector.
 4. The jackmodule of claim 1, wherein the first and second circuit board sectionsdefined by a flexible circuit board including a bend portion thatelectrically connects the first and second circuit board sections. 5.The jack module of claim 1, wherein the first and second circuit boardsections are generally parallel.
 6. The jack module of claim 1, whereinthe jack module has a height less than 4 inches.
 7. The jack module ofclaim 1, wherein the jack module has a height less than or equal to 3.5inches.
 8. The jack module of claim 1, wherein the jack mount is sizedto hold at most 8 of the jack inserts.
 9. The jack module of claim 1,wherein the IN/OUT termination structures and the cross-connecttermination structures are offset from one another in a front-to-reardirection.
 10. The jack module of claim 1, wherein the cross-connecttermination structures and the IN/OUT termination structures includewire wrap members.
 11. The jack module of claim 10, wherein the wirewrap members are mechanically and electrically connected directly to thesecond circuit board section.
 12. The jack module of claim 1, whereinthe jack inserts each include a dielectric body in which the tip rings,the ring springs and the normal springs are mounted, the dielectric bodyincluding front and rear ends, the front end defining the access ports,and the springs including tails that project rearwardly from the rearend of the dielectric body.
 13. The jack module of claim 1, wherein eachjack insert defines two monitor ports accessible from the front of thejack mount.
 14. A telecommunications jack module comprising: a jackmount for mounting within a chassis, the jack mount having a front and arear; a plurality of jack inserts adapted to be inserted into the jackmount through the front of the jack mount, the jack inserts includingaccess ports adapted for receiving plugs, the jack inserts includingnormal-through switches having tip and ring springs for contacting theplugs when the plugs are inserted within the access ports, the normalthrough switches also including normal springs that engage the tip andring springs when the plugs are not inserted in the access ports, theaccess ports being accessible from the front of the jack mount; IN/OUTtermination structures accessible from the rear of the jack mount;cross-connect termination structures accessible from the rear of thejack mount, the cross-connect termination structures being rearwardlyoffset from the IN/OUT termination structures; first and second circuitboard sections electrically connected together, the first circuit boardsection being located behind the jack mount and in front of the secondcircuit board section, the second circuit board section being located infront of the cross-connect termination structures and the IN/OUTtermination structures, the first and second circuit board sections eachincluding a major first side and a major second side, the major firstsides facing in a forward direction and the major second sides facing ina rearward direction; and normal-through circuits that electricallyconnect the IN/OUT termination structures to the cross-connecttermination structures, the normal-through circuits including thenormal-through switches, the normal-through circuits also includingelectrical pathways provided by the first and second circuit boardsections.
 15. A telecommunications device comprising: a chassis having afront and a rear; a plurality of jack inserts mounted in the chassis,the jack inserts including access ports adapted for receiving plugs, thejack inserts including normal-through switches having tip and ringsprings for contacting the plugs when the plugs are inserted within theaccess ports, the normal through switches also including normal springsthat engage the tip and ring springs when the plugs are not inserted inthe access ports, the access ports being accessible from the front ofthe chassis; IN/OUT termination structures accessible from the rear ofthe jack mount; cross-connect termination structures accessible from therear of the jack mount, the cross-connect termination structures beingrearwardly offset from the IN/OUT termination structures; the jackinserts each including a dielectric body in which the tip springs, thering springs and the normal springs are mounted, the dielectric bodyincluding front and rear ends, the front end defining the access ports,and the springs including tails that project rearwardly from the rearend of the dielectric body; and normal-through circuits thatelectrically connect the IN/OUT termination structures to thecross-connect termination structures, the normal-through circuitsincluding the normal-through switches.
 16. The telecommunications deviceof claim 15, further including a tray coupled to the chassis adjacent tothe cross-connect termination structures for managing cables/wiresterminating at the cross-connect termination structures.